Plasma Cleaner – Samco PC-300

Samco PC300 plasma cleaner has a parallel-plate configuration that can be used in both plasma etching (PE) mode as well as reactive ion etching (RIE) mode for isotropic and anisotropic etching respectively. It can be used for stripping photoresist, descumming, ashing, and surface cleaning or modification for substrate bonding, wire bonding, and microfluidics applications. Please contact staff for approved materials and processes.

  • Touch Screen Interface
  • RF power 300W max, 13.56 MHz
  • Maximum substrate size: 12” x 9”
  • Minimum substrate size: none
  • Reactive Ion Etching
  • Plasma Etching
  • O2 Plasma

Training Manual: Plasma Cleaner