Laser Cutter – LPKF ProtoLaser R

LPKF Protolaser R is a full-scale production level CNC laser cutter which can be used to cut or ablate materials such as PCBs, Si wafers, glass, metals and polymers such as PDMS and Polyimide. Its picosecond laser ablates materials with virtually no heat input. It practically eliminates heat transfer; the targeted material evaporates immediately minimizing the damage to the surrounding material. This allows even complex thin film systems, temperature-sensitive substrates, and OLED coatings on glass to be ablated or structured with a high degree of control. The laser system requires no masks or films to accomplish these tasks.

  • Maximum substrate size: 12” x 9”
  • Minimum substrate size: 5 mm x 5 mm
  • Substrate thickness: 0.02 to 10 mm
  • Beam diameter 15 um
  • Minimum cut width 20 um
  • Camera system for substrate inspection, alignment, and basic measurement functions
  • Conversion software for DXF, Gerber files
  • Picosecond Laser Module (1030 nm), 1 ps pulse duration, max 200 kHz pulse frequency, max 3.73 W power

Training Document: ProtoLaser R