The iBond 5000 is a ball bonder for making electrical interconnections between a chip and the package. Ball bonding processes use a combination of heat, pressure, and ultrasonic energy to make a weld at each end of the wire. This wire bonder is set up to use gold wire with a diameter of 25 mm and works on gold as well as other metallic pads.
- Touch screen interface.
- Missing ball detection and auto-stop.
- Ball bonding, bumping, coining, security bond and tab.
- Semi-automatic/manual mode with Z option.
Training Document: iBond5000 Ball Bond Operation Manual
