Maskless Aligner – Heidelberg uPG501

  • Maximum substrate size: 6” x 6”
  • Minimum substrate size: 6 x 6 mm²
  • Substrate thickness: 0 to 6 mm
  • Encoder resolution: 20 nm
  • Optical system including highly reflective mirrors and DMDTM
  • Real time air-gauge autofocus with dynamic range of 80 μm
  • Camera system for substrate inspection, automatic alignment, and basic measurement functions
  • Basic gray scale exposure mode with 128 intensity levels
  • Conversion software for DXF, CIF, GDSII, and Gerber files for binary exposures and BMP, STL, and ASCII files for gray scale
  • LED Illumination Module (390nm)
  • Minimum structure size [μm]: 1
  • Address grid [nm]: 50
  • Edge roughness [3σ, nm]: 100
  • Line width uniformity [3σ, nm]: 200
  • Alignment Accuracy [3σ, nm]: 200
  • Write speed [mm2/minute]: 50
  • Maximum write area [mm x mm]: 125 x 125

Maskless Aligner

Training Manual: maskless_aligner_10222015