Ball Wire Bonder – iBond5000

The iBond 5000 is a ball bonder for making electrical interconnections between a chip and the package. Ball bonding processes use a combination of heat, pressure, and ultrasonic energy to make a weld at each end of the wire. This wire bonder is set up to use gold wire with a diameter of 25 mm and works on gold as well as other metallic pads.

  • Touch screen interface.
  • Missing ball detection and auto-stop.
  • Ball bonding, bumping, coining, security bond and tab.
  • Semi-automatic/manual mode with Z option.

Training Document: iBond5000 Ball Bond Operation Manual

ballwire bonder - iBond500